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コンピューティングパワー放熱構造部品の世界市場規模、シェア、企業ランキング、売上、需要動向予測（2026～2032年）

Computing Power Heat Dissipation Structural Components- Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032
  • レポートID：
    86426
  • 発表時期：
    2026-01-05
  • レポート形式：
    PDF
  • 産業カテゴリー：
    機械及び設備
  • レポート言語：
    英語、日本語
  • ページ数：
    119
  • 発行会社（調査会社）：
    QYResearch
title

言語とエディションの価格

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title

レポートの概要

本報告書は、世界のコンピューティングパワー放熱構造部品市場について包括的な分析を行い、市場全体の動向を明らかにすることを目的としています。総販売数量、売上高、価格動向に加え、主要企業の市場シェアおよび順位を整理し、市場構造を多角的に把握します。さらに、地域・国別、製品タイプ別、用途分野別などの観点からコンピューティングパワー放熱構造部品市場を分析し、需要構造と成長特性を明確化します。
コンピューティングパワー放熱構造部品市場の規模、推定値および予測は、2025年を基準年とし、2021年から2032年までの期間における販売数量および売上高に基づいて提示しています。定量分析と定性分析を組み合わせることで、ビジネスおよび成長戦略を検討し、市場競争環境を評価し、企業の市場ポジションを把握した上で、コンピューティングパワー放熱構造部品に関する的確な意思決定を行うための実践的なインサイトを提供します。
 主要コンピューティングパワー放熱構造部品市場の統計
2025年世界市場規模：809百万米ドル
2026年世界市場規模：959百万米ドル
2032年予測市場規模：2951百万米ドル
2026–2032年予測期間CAGR：20.6%
本レポートはコンピューティングパワー放熱構造部品市場の中長期的な成長動向を定量分析および定性分析の両面から体系的に整理しています。 
【市場セグメンテーション】
主要企業・競争環境
コンピューティングパワー放熱構造部品市場の主要企業には以下が含まれます：
Delta Electronics, Inc.
NIDEC CORPORATION
Dongguan Manko Hardware Products Co., Ltd.
Auras Technology Co., Ltd.
Jiangsu Gian Technology Co., Ltd.
Shenzhen FRD Technology Co., Ltd.
Casetek Precision Industrial Co., Ltd.
Beijing Zhongshi Weiye Technology Co., Ltd.
Guangdong Lingyi Intelligent Manufacturing Co., Ltd.
Taico Electronic (Zhuhai) Co., Ltd.
Forcecon Technology Co., Ltd.
Suzhou Tianmai Thermal Technology Co., Ltd.
QuanJing Technology Co., Ltd.
Shenzhen Winboth Thermal Technology Co., Ltd. 

製品別
Air-cooled
Liquid-cooled 

アプリケーション別
Server
Consumer Electronics
Telecommunication Equipment
Other 

レポート対象地域
北米：アメリカ、カナダ、その他
アジア太平洋：中国、日本、韓国、東南アジア、インド、オーストラリア、その他
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、オランダ、北欧諸国、その他
ラテンアメリカ：メキシコ、ブラジル、その他
中東・アフリカ：トルコ、サウジアラビア、UAE、その他

レポート構成（章別概要）
第1章｜市場概要と成長展望
コンピューティングパワー放熱構造部品市場の全体像を整理し、市場規模、売上予測、価格推移を体系的に解説します。同時に成長要因、市場機会、業界課題、リスク要因を分析し、中長期的な市場展望を提示します
第2章｜主要企業の競争分析
コンピューティングパワー放熱構造部品市場における主要プレイヤー（トップ5社・トップ10社）を対象に、売上高、製造拠点、製品構成、価格戦略、販売量、市場シェアを多面的に分析し、競争構造を明確化します
第3章｜製品カテゴリ別市場動向
製品タイプ別にコンピューティングパワー放熱構造部品市場を分類し、売上高、市場シェア、販売量、価格動向を分析します。成長性の高い製品分野と市場構造の変化を明らかにします
第4章｜用途別市場動向
用途別にコンピューティングパワー放熱構造部品市場規模、売上高、市場シェア、販売量、価格推移を整理し、業界別の需要動向と成長ポテンシャルを分析します
第5章｜地域別市場分析
地域別の市場成長率、販売量、売上高を詳細に分析し、コンピューティングパワー放熱構造部品市場の地理的需要構造を可視化します。各地域の市場規模推移と将来の成長余地を評価します
第6章｜国別市場動向
主要国・地域ごとに、コンピューティングパワー放熱構造部品市場の販売量、売上高、成長要因、政策・規制環境、競争特性を整理し、国別市場の特徴を明確にします
第7章｜主要企業プロファイル
コンピューティングパワー放熱構造部品市場を牽引する主要企業について、売上高、販売量、価格動向、粗利益率、製品ポートフォリオ、最新の戦略動向を詳細に解説します
第8章｜バリューチェーンと市場構造分析
業界全体のサプライチェーンを上流から下流まで整理し、コスト構造や流通モデルの動向を分析します
第9章｜調査結果
調査結果を総括し、市場全体のトレンド、今後の成長機会、潜在的リスク、戦略的な洞察を提示します
第10章｜付録（調査手法・データソース）
調査設計、分析手法、使用データソースの詳細を明示し、レポートの信頼性と透明性を担保します

本レポートの要点と洞察
●コンピューティングパワー放熱構造部品市場の全体像と成長見通し
コンピューティングパワー放熱構造部品市場の規模変化の傾向、成長予測及び需要動向を体系的に整理いたします。2021年から2025年までの実績データに基づき、2032年までの中長期予測を提示し、市場の拡大速度と成長潜在力を明らかにします。同時に、最近の関税調整措置など各国の政策動向を踏まえ、多角的にグローバル経済環境がコンピューティングパワー放熱構造部品市場に与える影響を分析いたします。
●市場環境の構成要素とマクロトレンド
コンピューティングパワー放熱構造部品産業を取り巻く市場環境について、需要構造の変化、政策対応、技術革新の進展といった主要要因を整理します。特に、国際貿易政策や関税政策の変化が企業戦略や価格形成に及ぼす影響、サプライチェーン再編の動きと事業運営への波及効果を明確化し、市場環境の全体像を包括的に提示します。
●競争構造と主要企業の動向分析
コンピューティングパワー放熱構造部品市場における主要企業の売上規模、市場シェア、競争ポジションを整理し、競争構造の特徴を分析します。各社の競争戦略、事業拡大の方向性、新製品・新技術の投入動向を通じて、技術革新が市場競争に与える影響と競争環境の変化を解読します。
●競争環境と事業動向の把握
製品タイプ別、用途別、地域・国別の観点からコンピューティングパワー放熱構造部品市場のセグメント構造を整理します。各地域の需要構成と成長特性を比較分析し、各細分領域が市場全体の成長に与える貢献度と相互関連性を明確にします。
●成長要因・課題・リスクの分析
コンピューティングパワー放熱構造部品市場の成長を支える主要ドライバーを整理するとともに、業界特有の課題や潜在的リスクを分析します。原材料調達、供給システム、事業運営における不確実性を踏まえ、サプライチェーン及び事業レジリエンス強化の方向性についても考察します。
●将来トレンドと市場展望
コンピューティングパワー放熱構造部品市場の中長期的な成長トレンドと将来の発展シナリオを提示します。持続的成長を実現するための重要な成功要因を整理し、今後の市場参入企業や既存プレイヤーの戦略的意思決定に参考となる視点を提供いたします。
title

Description

The global market for Computing Power Heat Dissipation Structural Components was estimated to be worth US$ 809 million in 2025 and is projected to reach US$ 2951 million, growing at a CAGR of 20.6% from 2026 to 2032.

The potential shifts in the 2025 U.S. tariff framework pose substantial volatility risks to global markets. This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Computing Power Heat Dissipation Structural Components cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
In 2024, the price of computing power heat dissipation structural components was ​​$4,049 per thousand units, with total sales reaching ​180 million units.

Computing Power Heat Dissipation Structural Components​​ are core metal structural parts that provide mechanical support and thermal conduction pathways for the cooling systems of high-performance computing devices (e.g., AI servers, GPU accelerators, data center switches). These components encompass precision die-cast/CNC-machined liquid cold plate substrates, high-thermal-conductivity fin array brackets, high-pressure-resistant sealed housings, and customized cooling frames for heterogeneous computing chips. They must meet stringent requirements for high heat flux density, multi-dimensional thermal topology, and long-term corrosion resistance. Their materials (e.g., copper alloys, aluminum silicon carbide) and manufacturing processes (e.g., ultra-thin channel milling, vacuum brazing) directly determine the cooling efficiency and reliability of computing equipment, serving as the critical physical interface between heat-generating units and active cooling components (e.g., liquid cooling pumps, immersion cooling systems).

The North American market for Computing Power Heat Dissipation Structural Components was valued at US$ million in 2025 and is projected to reach US$ million by 2032, at a CAGR of % from 2026 to 2032.

The Asia-Pacific market for Computing Power Heat Dissipation Structural Components was valued at $ million in 2025 and is projected to climb to US$ million by 2032, at a CAGR of % from 2026 to 2032.

The European market for Computing Power Heat Dissipation Structural Components was valued at $ million in 2025 and is projected to total US$ million by 2032, at a CAGR of % from 2026 to 2032.

The global key companies in the Computing Power Heat Dissipation Structural Components market include Delta Electronics, Inc.、NIDEC CORPORATION、Dongguan Manko Hardware Products Co., Ltd.、Auras Technology Co., Ltd.、Jiangsu Gian Technology Co., Ltd.、Shenzhen FRD Technology Co., Ltd.、Casetek Precision Industrial Co., Ltd.、Beijing Zhongshi Weiye Technology Co., Ltd.、Guangdong Lingyi Intelligent Manufacturing Co., Ltd.、Taico Electronic (Zhuhai) Co., Ltd., etc. In 2025, the five largest players accounted for approximately % of revenue.

This report provides a comprehensive view of the global market for Computing Power Heat Dissipation Structural Components, covering total sales volume, sales revenue, pricing, the market share and ranking of key companies, along with analyses by region & country, by Type, and by Application.

The Computing Power Heat Dissipation Structural Components market size, estimations, and forecasts are presented in terms of sales volume (K Units) and revenue ($ millions), with 2025 as the base year and historical and forecast data from 2021 to 2032. The report combines quantitative and qualitative analysis to help readers develop growth strategies, assess the competitive landscape, evaluate their position in the current marketplace, and make informed business decisions regarding Computing Power Heat Dissipation Structural Components.

Market Segmentation
By Company
    Delta Electronics, Inc.
    NIDEC CORPORATION
    Dongguan Manko Hardware Products Co., Ltd.
    Auras Technology Co., Ltd.
    Jiangsu Gian Technology Co., Ltd.
    Shenzhen FRD Technology Co., Ltd.
    Casetek Precision Industrial Co., Ltd.
    Beijing Zhongshi Weiye Technology Co., Ltd.
    Guangdong Lingyi Intelligent Manufacturing Co., Ltd.
    Taico Electronic (Zhuhai) Co., Ltd.
    Forcecon Technology Co., Ltd.
    Suzhou Tianmai Thermal Technology Co., Ltd.
    QuanJing Technology Co., Ltd.
    Shenzhen Winboth Thermal Technology Co., Ltd.

Segment by Type
    Air-cooled
    Liquid-cooled

Segment by Application
    Server
    Consumer Electronics
    Telecommunication Equipment
    Other

By Region
    North America
    Europe
    China
    Japan

Consumption by Region
    North America
        United States
        Canada
    Asia-Pacific
        China
        Japan
        South Korea
        Southeast Asia
        India
        Australia
        Rest of Asia-Pacific
    Europe
        Germany
        France
        U.K.
        Italy
        Netherlands
        Nordic Countries
        Rest of Europe
    Latin America
        Mexico
        Brazil
        Rest of Latin America
    Middle East & Africa
        Turkey
        Saudi Arabia
        UAE
        Rest of MEA

Chapter Outline
Chapter 1: Introduces the scope of the report and the global market size (value, volume, and price). It also summarizes market dynamics and Recent Developments; identifies key drivers and restraints; outlines challenges and risks for manufacturers; reviews relevant industry policies and U.S. tariff implications.
Chapter 2: Provides a detailed analysis of the Computing Power Heat Dissipation Structural Components manufacturers' competitive landscape—including pricing, sales and revenue shares, Recent Developments plans, and mergers and acquisitions (M&A).
Chapter 3: Analyzes market segmentation by Type, presenting the size and growth potential of each segment to help readers identify blue-ocean opportunities.
Chapter 4: Analyzes market segmentation by Application, presenting the size and growth potential of each downstream segment to help readers identify blue-ocean opportunities.
Chapter 5: Presents Computing Power Heat Dissipation Structural Components sales and revenue at the regional level. It offers a quantitative assessment of market size and growth potential by region and summarizes market development, future prospects, addressable space, and country-level market size worldwide.
Chapter 6: Presents Computing Power Heat Dissipation Structural Components sales and revenue at the country level. It provides segmented data by Type and by Application for each country/region.
Chapter 7: Profiles key players, detailing the main companies' product sales, revenue, pricing, gross margin, product portfolios, Recent Developments, etc.
Chapter 8: Analyzes the industry value chain, including upstream suppliers and downstream applications/customers.
Chapter 9: Conclusion.
title

Table of Contents

1 Market Overview
    1.1 Computing Power Heat Dissipation Structural Components Product Introduction
    1.2 Global Computing Power Heat Dissipation Structural Components Market Size Forecast
        1.2.1 Global Computing Power Heat Dissipation Structural Components Sales Value (2021–2032)
        1.2.2 Global Computing Power Heat Dissipation Structural Components Sales Volume (2021–2032)
        1.2.3 Global Computing Power Heat Dissipation Structural Components Sales Price (2021–2032)
    1.3 Computing Power Heat Dissipation Structural Components Market Trends & Drivers
        1.3.1 Computing Power Heat Dissipation Structural Components Industry Trends
        1.3.2 Computing Power Heat Dissipation Structural Components Market Drivers & Opportunities
        1.3.3 Computing Power Heat Dissipation Structural Components Market Challenges
        1.3.4 Computing Power Heat Dissipation Structural Components Market Restraints
        1.3.5 Impact of U.S. Tariffs
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered
2 Competitive Analysis by Company
    2.1 Global Computing Power Heat Dissipation Structural Components Players Revenue Ranking (2025)
    2.2 Global Computing Power Heat Dissipation Structural Components Revenue by Company (2021–2026)
    2.3 Global Computing Power Heat Dissipation Structural Components Sales Volume Ranking of Players (2025)
    2.4 Global Computing Power Heat Dissipation Structural Components Sales Volume by Company (2021–2026)
    2.5 Global Computing Power Heat Dissipation Structural Components Average Price by Company (2021–2026)
    2.6 Key Manufacturers Computing Power Heat Dissipation Structural Components Manufacturing Base and Headquarters
    2.7 Key Manufacturers Computing Power Heat Dissipation Structural Components Product Offerings
    2.8 Key Manufacturers Start of Mass Production of Computing Power Heat Dissipation Structural Components
    2.9 Computing Power Heat Dissipation Structural Components Market Competitive Analysis
        2.9.1 Computing Power Heat Dissipation Structural Components Market Concentration Rate (2021–2026)
        2.9.2 Global 5 and 10 Largest Manufacturers by Computing Power Heat Dissipation Structural Components Revenue in 2025
        2.9.3 Global Companies by Tier (Tier 1, Tier 2, Tier 3), based on Computing Power Heat Dissipation Structural Components revenue, 2025
    2.10 Mergers & Acquisitions and Expansion
3 Segmentation Computing Power Heat Dissipation Structural Components Market Classification
    3.1 Introduction by Type
        3.1.1 Air-cooled
        3.1.2 Liquid-cooled
        3.1.3 Global Computing Power Heat Dissipation Structural Components Sales Value by Type
            3.1.3.1 Global Computing Power Heat Dissipation Structural Components Sales Value by Type (2021 vs 2025 vs 2032)
            3.1.3.2 Global Computing Power Heat Dissipation Structural Components Sales Value, by Type (2021–2032)
            3.1.3.3 Global Computing Power Heat Dissipation Structural Components Sales Value, by Type (%), 2021–2032
        3.1.4 Global Computing Power Heat Dissipation Structural Components Sales Volume by Type
            3.1.4.1 Global Computing Power Heat Dissipation Structural Components Sales Volume by Type (2021 vs 2025 vs 2032)
            3.1.4.2 Global Computing Power Heat Dissipation Structural Components Sales Volume, by Type (2021–2032)
            3.1.4.3 Global Computing Power Heat Dissipation Structural Components Sales Volume, by Type (%), 2021–2032
        3.1.5 Global Computing Power Heat Dissipation Structural Components Average Price by Type (2021–2032)
4 Segmentation by Application
    4.1 Introduction by Application
        4.1.1 Server
        4.1.2 Consumer Electronics
        4.1.3 Telecommunication Equipment
        4.1.4 Other
    4.2 Global Computing Power Heat Dissipation Structural Components Sales Value by Application
        4.2.1 Global Computing Power Heat Dissipation Structural Components Sales Value by Application (2021 vs 2025 vs 2032)
        4.2.2 Global Computing Power Heat Dissipation Structural Components Sales Value, by Application (2021–2032)
        4.2.3 Global Computing Power Heat Dissipation Structural Components Sales Value, by Application (%), 2021–2032
    4.3 Global Computing Power Heat Dissipation Structural Components Sales Volume by Application
        4.3.1 Global Computing Power Heat Dissipation Structural Components Sales Volume by Application (2021 vs 2025 vs 2032)
        4.3.2 Global Computing Power Heat Dissipation Structural Components Sales Volume, by Application (2021–2032)
        4.3.3 Global Computing Power Heat Dissipation Structural Components Sales Volume, by Application (%), 2021–2032
    4.4 Global Computing Power Heat Dissipation Structural Components Average Price by Application (2021–2032)
5 Segmentation by Region
    5.1 Global Computing Power Heat Dissipation Structural Components Sales Value by Region
        5.1.1 Global Computing Power Heat Dissipation Structural Components Sales Value by Region: 2021 vs 2025 vs 2032
        5.1.2 Global Computing Power Heat Dissipation Structural Components Sales Value by Region (2021–2026)
        5.1.3 Global Computing Power Heat Dissipation Structural Components Sales Value by Region (2027–2032)
        5.1.4 Global Computing Power Heat Dissipation Structural Components Sales Value by Region (%), 2021–2032
    5.2 Global Computing Power Heat Dissipation Structural Components Sales Volume by Region
        5.2.1 Global Computing Power Heat Dissipation Structural Components Sales Volume by Region: 2021 vs 2025 vs 2032
        5.2.2 Global Computing Power Heat Dissipation Structural Components Sales Volume by Region (2021–2026)
        5.2.3 Global Computing Power Heat Dissipation Structural Components Sales Volume by Region (2027–2032)
        5.2.4 Global Computing Power Heat Dissipation Structural Components Sales Volume by Region (%), 2021–2032
    5.3 Global Computing Power Heat Dissipation Structural Components Average Price by Region (2021–2032)
    5.4 North America
        5.4.1 North America Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        5.4.2 North America Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
    5.5 Europe
        5.5.1 Europe Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        5.5.2 Europe Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
    5.6 Asia Pacific
        5.6.1 Asia Pacific Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        5.6.2 Asia Pacific Computing Power Heat Dissipation Structural Components Sales Value by Region (%), 2025 vs 2032
    5.7 South America
        5.7.1 South America Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        5.7.2 South America Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
    5.8 Middle East & Africa
        5.8.1 Middle East & Africa Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        5.8.2 Middle East & Africa Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions Computing Power Heat Dissipation Structural Components Sales Value Growth Trends, 2021 vs 2025 vs 2032
    6.2 Key Countries/Regions Computing Power Heat Dissipation Structural Components Sales Value and Sales Volume
        6.2.1 Key Countries/Regions Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.2.2 Key Countries/Regions Computing Power Heat Dissipation Structural Components Sales Volume, 2021–2032
    6.3 United States
        6.3.1 United States Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.3.2 United States Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.3.3 United States Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
    6.4 Europe
        6.4.1 Europe Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.4.2 Europe Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.4.3 Europe Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
    6.5 China
        6.5.1 China Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.5.2 China Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.5.3 China Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
    6.6 Japan
        6.6.1 Japan Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.6.2 Japan Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.6.3 Japan Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
    6.7 South Korea
        6.7.1 South Korea Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.7.2 South Korea Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.7.3 South Korea Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
    6.8 Southeast Asia
        6.8.1 Southeast Asia Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.8.2 Southeast Asia Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.8.3 Southeast Asia Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
    6.9 India
        6.9.1 India Computing Power Heat Dissipation Structural Components Sales Value, 2021–2032
        6.9.2 India Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
        6.9.3 India Computing Power Heat Dissipation Structural Components Sales Value by Application, 2025 vs 2032
7 Company Profiles
    7.1 Delta Electronics, Inc.
        7.1.1 Delta Electronics, Inc. Company Information
        7.1.2 Delta Electronics, Inc. Introduction and Business Overview
        7.1.3 Delta Electronics, Inc. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.1.4 Delta Electronics, Inc. Computing Power Heat Dissipation Structural Components Product Offerings
        7.1.5 Delta Electronics, Inc. Recent Developments
    7.2 NIDEC CORPORATION
        7.2.1 NIDEC CORPORATION Company Information
        7.2.2 NIDEC CORPORATION Introduction and Business Overview
        7.2.3 NIDEC CORPORATION Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.2.4 NIDEC CORPORATION Computing Power Heat Dissipation Structural Components Product Offerings
        7.2.5 NIDEC CORPORATION Recent Developments
    7.3 Dongguan Manko Hardware Products Co., Ltd.
        7.3.1 Dongguan Manko Hardware Products Co., Ltd. Company Information
        7.3.2 Dongguan Manko Hardware Products Co., Ltd. Introduction and Business Overview
        7.3.3 Dongguan Manko Hardware Products Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.3.4 Dongguan Manko Hardware Products Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.3.5 Dongguan Manko Hardware Products Co., Ltd. Recent Developments
    7.4 Auras Technology Co., Ltd.
        7.4.1 Auras Technology Co., Ltd. Company Information
        7.4.2 Auras Technology Co., Ltd. Introduction and Business Overview
        7.4.3 Auras Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.4.4 Auras Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.4.5 Auras Technology Co., Ltd. Recent Developments
    7.5 Jiangsu Gian Technology Co., Ltd.
        7.5.1 Jiangsu Gian Technology Co., Ltd. Company Information
        7.5.2 Jiangsu Gian Technology Co., Ltd. Introduction and Business Overview
        7.5.3 Jiangsu Gian Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.5.4 Jiangsu Gian Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.5.5 Jiangsu Gian Technology Co., Ltd. Recent Developments
    7.6 Shenzhen FRD Technology Co., Ltd.
        7.6.1 Shenzhen FRD Technology Co., Ltd. Company Information
        7.6.2 Shenzhen FRD Technology Co., Ltd. Introduction and Business Overview
        7.6.3 Shenzhen FRD Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.6.4 Shenzhen FRD Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.6.5 Shenzhen FRD Technology Co., Ltd. Recent Developments
    7.7 Casetek Precision Industrial Co., Ltd.
        7.7.1 Casetek Precision Industrial Co., Ltd. Company Information
        7.7.2 Casetek Precision Industrial Co., Ltd. Introduction and Business Overview
        7.7.3 Casetek Precision Industrial Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.7.4 Casetek Precision Industrial Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.7.5 Casetek Precision Industrial Co., Ltd. Recent Developments
    7.8 Beijing Zhongshi Weiye Technology Co., Ltd.
        7.8.1 Beijing Zhongshi Weiye Technology Co., Ltd. Company Information
        7.8.2 Beijing Zhongshi Weiye Technology Co., Ltd. Introduction and Business Overview
        7.8.3 Beijing Zhongshi Weiye Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.8.4 Beijing Zhongshi Weiye Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.8.5 Beijing Zhongshi Weiye Technology Co., Ltd. Recent Developments
    7.9 Guangdong Lingyi Intelligent Manufacturing Co., Ltd.
        7.9.1 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Company Information
        7.9.2 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Introduction and Business Overview
        7.9.3 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.9.4 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.9.5 Guangdong Lingyi Intelligent Manufacturing Co., Ltd. Recent Developments
    7.10 Taico Electronic (Zhuhai) Co., Ltd.
        7.10.1 Taico Electronic (Zhuhai) Co., Ltd. Company Information
        7.10.2 Taico Electronic (Zhuhai) Co., Ltd. Introduction and Business Overview
        7.10.3 Taico Electronic (Zhuhai) Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.10.4 Taico Electronic (Zhuhai) Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.10.5 Taico Electronic (Zhuhai) Co., Ltd. Recent Developments
    7.11 Forcecon Technology Co., Ltd.
        7.11.1 Forcecon Technology Co., Ltd. Company Information
        7.11.2 Forcecon Technology Co., Ltd. Introduction and Business Overview
        7.11.3 Forcecon Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.11.4 Forcecon Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.11.5 Forcecon Technology Co., Ltd. Recent Developments
    7.12 Suzhou Tianmai Thermal Technology Co., Ltd.
        7.12.1 Suzhou Tianmai Thermal Technology Co., Ltd. Company Information
        7.12.2 Suzhou Tianmai Thermal Technology Co., Ltd. Introduction and Business Overview
        7.12.3 Suzhou Tianmai Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.12.4 Suzhou Tianmai Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.12.5 Suzhou Tianmai Thermal Technology Co., Ltd. Recent Developments
    7.13 QuanJing Technology Co., Ltd.
        7.13.1 QuanJing Technology Co., Ltd. Company Information
        7.13.2 QuanJing Technology Co., Ltd. Introduction and Business Overview
        7.13.3 QuanJing Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.13.4 QuanJing Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.13.5 QuanJing Technology Co., Ltd. Recent Developments
    7.14 Shenzhen Winboth Thermal Technology Co., Ltd.
        7.14.1 Shenzhen Winboth Thermal Technology Co., Ltd. Company Information
        7.14.2 Shenzhen Winboth Thermal Technology Co., Ltd. Introduction and Business Overview
        7.14.3 Shenzhen Winboth Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Sales, Revenue, Price and Gross Margin (2021–2026)
        7.14.4 Shenzhen Winboth Thermal Technology Co., Ltd. Computing Power Heat Dissipation Structural Components Product Offerings
        7.14.5 Shenzhen Winboth Thermal Technology Co., Ltd. Recent Developments
8 Industry Chain Analysis
    8.1 Computing Power Heat Dissipation Structural Components Industrial Chain
    8.2 Computing Power Heat Dissipation Structural Components Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Key Suppliers of Raw Materials
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customer Analysis)
    8.5 Sales Model and Sales Channelss
        8.5.1 Computing Power Heat Dissipation Structural Components Sales Model
        8.5.2 Sales Channels
        8.5.3 Computing Power Heat Dissipation Structural Components Distributors
9 Research Findings and Conclusion
10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
            10.1.1.1 Research Programs/Design
            10.1.1.2 Market Size Estimation
            10.1.1.3 Market Breakdown and Data Triangulation
        10.1.2 Data Source
            10.1.2.1 Secondary Sources
            10.1.2.2 Primary Sources
    10.2 Author Details
    10.3 Disclaimer
title

Table of Figures

List of Tables
 Table 1. Computing Power Heat Dissipation Structural Components Market Trends
 Table 2. Computing Power Heat Dissipation Structural Components Market Drivers & Opportunities
 Table 3. Computing Power Heat Dissipation Structural Components Market Challenges
 Table 4. Computing Power Heat Dissipation Structural Components Market Restraints


List of Figures
 Figure 1. Computing Power Heat Dissipation Structural Components Product Picture
 Figure 2. Global Computing Power Heat Dissipation Structural Components Sales Value, 2021 vs 2025 vs 2032 (US$ Million)
 Figure 3. Global Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 4. Global Computing Power Heat Dissipation Structural Components Sales Volume (K Units), 2021–2032
 Figure 5. Global Computing Power Heat Dissipation Structural Components Sales Price (US$/Unit), 2021–2032
 Figure 6. Computing Power Heat Dissipation Structural Components Report Years Considered
 Figure 7. Global Computing Power Heat Dissipation Structural Components Players Revenue Ranking (US$ Million), 2025
 Figure 8. Global Computing Power Heat Dissipation Structural Components Sales Volume Ranking of Players (K Units), 2025
 Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Computing Power Heat Dissipation Structural Components Revenue in 2025
 Figure 10. Computing Power Heat Dissipation Structural Components Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2021 vs 2025
 Figure 11. Air-cooled Picture
 Figure 12. Liquid-cooled Picture
 Figure 13. Global Computing Power Heat Dissipation Structural Components Sales Value by Type (US$ Million), 2021 vs 2025 vs 2032
 Figure 14. Global Computing Power Heat Dissipation Structural Components Sales Value Market Share by Type, 2025 & 2032
 Figure 15. Global Computing Power Heat Dissipation Structural Components Sales Volume by Type (K Units), 2021 vs 2025 vs 2032
 Figure 16. Global Computing Power Heat Dissipation Structural Components Sales Volume Market Share by Type, 2025 & 2032
 Figure 17. Global Computing Power Heat Dissipation Structural Components Price by Type (US$/Unit), 2021–2032
 Figure 18. Product Picture of Server
 Figure 19. Product Picture of Consumer Electronics
 Figure 20. Product Picture of Telecommunication Equipment
 Figure 21. Product Picture of Other
 Figure 22. Global Computing Power Heat Dissipation Structural Components Sales Value by Application (US$ Million), 2021 vs 2025 vs 2032
 Figure 23. Global Computing Power Heat Dissipation Structural Components Sales Value Market Share by Application, 2025 & 2032
 Figure 24. Global Computing Power Heat Dissipation Structural Components Sales Volume by Application (K Units), 2021 vs 2025 vs 2032
 Figure 25. Global Computing Power Heat Dissipation Structural Components Sales Volume Market Share by Application, 2025 & 2032
 Figure 26. Global Computing Power Heat Dissipation Structural Components Price by Application (US$/Unit), 2021–2032
 Figure 27. North America Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 28. North America Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
 Figure 29. Europe Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 30. Europe Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
 Figure 31. Asia Pacific Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 32. Asia Pacific Computing Power Heat Dissipation Structural Components Sales Value by Region (%), 2025 vs 2032
 Figure 33. South America Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 34. South America Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
 Figure 35. Middle East & Africa Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 36. Middle East & Africa Computing Power Heat Dissipation Structural Components Sales Value by Country (%), 2025 vs 2032
 Figure 37. Key Countries/Regions Computing Power Heat Dissipation Structural Components Sales Value (%), 2021–2032
 Figure 38. Key Countries/Regions Computing Power Heat Dissipation Structural Components Sales Volume (%), 2021–2032
 Figure 39. United States Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 40. United States Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 41. United States Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 42. Europe Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 43. Europe Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 44. Europe Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 45. China Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 46. China Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 47. China Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 48. Japan Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 49. Japan Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 50. Japan Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 51. South Korea Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 52. South Korea Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 53. South Korea Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 54. Southeast Asia Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 55. Southeast Asia Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 56. Southeast Asia Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 57. India Computing Power Heat Dissipation Structural Components Sales Value (US$ Million), 2021–2032
 Figure 58. India Computing Power Heat Dissipation Structural Components Sales Value by Type (%), 2025 vs 2032
 Figure 59. India Computing Power Heat Dissipation Structural Components Sales Value by Application (%), 2025 vs 2032
 Figure 60. Computing Power Heat Dissipation Structural Components Industrial Chain
 Figure 61. Computing Power Heat Dissipation Structural Components Manufacturing Cost Structure
 Figure 62. Channels of Distribution (Direct Sales, and Distribution)
 Figure 63. Bottom-up and Top-down Approaches for This Report
 Figure 64. Data Triangulation
 Figure 65. Key Executives Interviewed

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